Title :
The intertool profile interchange format: an object-oriented approach (semiconductor technology CAD/CAM)
Author :
Boning, D.S. ; Heytens, M.L. ; Wong, A.S.
Author_Institution :
Microsyst. Technol. Lab., MIT, Cambridge, MA, USA
Abstract :
A formal object-oriented approach to the data structuring and data management of semiconductor wafer structure and device information is presented. The profile interchange format (PIF) is extended beyond a file format ´intersite´ version in order to enhance the storage and access of profile information, the communication of profile information between cooperating tools, and the integration and portability of technology CAD (computer-aided design) tools. An intertool PIF toolkit is a programmatic interface to profile information, consisting of a library of objects for the storage and manipulation of data by technology CAD tools. PIF/Gestalt is presented as a test implementation of the toolkit which provides C and Common Lisp language interfaces, implemented on a database for use in a CAD/CIM (computer integrated manufacturing) system for semiconductor process design and fabrication.<>
Keywords :
CAD; data structures; digital simulation; electronic data interchange; electronic engineering computing; integrated circuit manufacture; integrated circuit technology; manufacturing data processing; object-oriented databases; semiconductor device models; semiconductor technology; C language interface; CIM; Common Lisp language interfaces; PIF toolkit; PIF/Gestalt; computer integrated manufacturing; computer-aided design; data management; data structuring; database; device information; fabrication; intertool profile interchange format; object-oriented approach; programmatic interface; semiconductor process design; semiconductor wafer structure; CADCAM; Data structures; Design automation; Object oriented modeling; Semiconductor device modeling; Semiconductor device testing; Semiconductor process modeling; System testing;
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
