• DocumentCode
    1368885
  • Title

    Focus characterization using end of line metrology

  • Author

    Leroux, Pierre ; Ziger, David ; Juig, Noris

  • Author_Institution
    Philips Semicond., San Antonio, TX, USA
  • Volume
    13
  • Issue
    3
  • fYear
    2000
  • fDate
    8/1/2000 12:00:00 AM
  • Firstpage
    322
  • Lastpage
    330
  • Abstract
    A new method is introduced to measure relative focus using conventional optical overlay instruments. Optical end of line metrology (OELM), is based on patterning a wide frame in which adjacent sides are constructed of submicron sized lines that run perpendicular to the center opening. Because truncation is size dependent, line and space features exhibit significantly more line shortening effects than the solid sections. When measured with a conventional optical overlay tool, the difference in line shortening between the solid and line and space sections are measured as an alignment offset, which is a relative measure of actual line shortening. Reproducibility for measuring the apparent misalignment of these modified box-in-box structures was 3 nm (3σest), which is similar to the repeatability for measuring conventional resist box in box alignment boxes. Truncation is sensitive to focus and the utility for using OELM toward characterizing focus-dependent lens parameters was investigated. Estimated 3σ for calculating best focus and astigmatism were 0.04 μm and 0.01 μm, respectively. Focus corrections were accurate to 0.05 μm within ±0.3 μm of best focus. Additionally, a general method is presented to estimate the error in the calculated best focus
  • Keywords
    aberrations; focusing; integrated circuit measurement; lenses; photolithography; alignment offset; astigmatism; box-in-box structures; focus characterization; lens parameters; line shortening effects; optical end of line metrology; optical overlay instruments; photolithography; relative focus; submicron sized lines; Focusing; Gratings; Instruments; Lenses; Metrology; Optical scattering; Optical sensors; Resists; Scanning electron microscopy; Solids;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/66.857943
  • Filename
    857943