DocumentCode :
1369202
Title :
On the relationship of quality factor and hollow winding structure of coreless printed spiral winding (CPSW) inductor
Author :
Yipeng Su ; Xun Liu ; Chi Kwan Lee ; Hui, S.Y.
Author_Institution :
Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
Volume :
27
Issue :
6
fYear :
2012
fDate :
6/1/2012 12:00:00 AM
Firstpage :
3050
Lastpage :
3056
Abstract :
The principle of using hollow spiral winding is not novel, but the study on this topic is far from complete. In this paper, how hollow the central region of the coreless printed spiral winding (CPSW) inductor should be for a given footprint area in order to achieve the maximal quality factor Qmax and to maintain high inductance value is explored. A hollow factor based on the ratio of the inner hollow radius and the outer winding radius τ = Rin/Rout, is proposed as for optimization and quantifying how hollow a spiral winding is. The relationship between τ and Qmax, which depends on the operating frequency and the dimensional parameters of CPSW inductor, is established. For a specific operating frequency, it is discovered that if the conductor width is comparable with the skin depth, or the conductors are placed relatively far away from each others, the hollow design of the CPSW inductor has little improvement on Q but reduces the inductance. If the conductor width is much larger than the skin depth and the conductors are closely placed, the hollow spiral design is recommended. The optimal range of τ with which the Qmax can be achieved is found to be around 0.45-0.55.
Keywords :
Q-factor; conductors (electric); inductance; inductors; windings; CPSW inductor; conductor width; coreless printed spiral winding inductor; dimensional parameters; hollow spiral winding; hollow winding structure; inductance value; inner hollow radius; optimization; outer winding radius; quality factor; Conductors; Inductance; Inductors; Magnetic cores; Q factor; Spirals; Windings; Planar magnetics; quality factor;
fLanguage :
English
Journal_Title :
Power Electronics, IEEE Transactions on
Publisher :
ieee
ISSN :
0885-8993
Type :
jour
DOI :
10.1109/TPEL.2011.2174654
Filename :
6069869
Link To Document :
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