Title : 
Mixed-Mode ABCD Parameters: Theory and Application to Signal Integrity Analysis of PCB-Level Differential Interconnects
         
        
            Author : 
Cho, Jeonghyeon ; Song, Eakhwan ; Kim, Heegon ; Ahn, Seungyoung ; Pak, Jun So ; Kim, Jiseong ; Kim, Joungho
         
        
            Author_Institution : 
Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
         
        
        
        
        
        
        
            Abstract : 
The mixed-mode ABCD parameters are newly introduced and developed, where the definition and the connection are carefully established to have both the advantages of the mixed-mode S-parameters and the ABCD parameters, simultaneously. In addition, closed-form equations to model symmetric and asymmetric coupled transmission lines are derived. With the derived equations, the voltage transfer functions and the eye diagram of a variety of printed circuit board (PCB)-level differential interconnects are analytically attainable, which greatly enhances their applicability for signal integrity analysis. To verify the derived equations and to validate the proposed mixed-mode ABCD parameters, a series of microstrip-type differential lines on PCB test vehicles were fabricated and tested. The effectiveness of the proposed mixed-mode ABCD parameters was successfully confirmed through the comparison studies, in particular for the case of mode-conversion occurrence at the differential lines.
         
        
            Keywords : 
S-parameters; microstrip lines; printed circuit testing; printed circuits; transmission lines; PCB test vehicles; PCB-level differential interconnects; asymmetric coupled transmission lines; closed-form equations; derived equations; microstrip-type differential lines; mixed-mode ABCD parameters; mixed-mode S-parameters; printed circuit board-level differential interconnects; signal integrity analysis; voltage transfer functions; Equations; Impedance; Mathematical model; Power transmission lines; Scattering parameters; Transfer functions; Transmission line matrix methods; Differential interconnect; eye diagram; mixed-mode ABCD parameters; printed circuit board (PCB); signal integrity; transfer function;
         
        
        
            Journal_Title : 
Electromagnetic Compatibility, IEEE Transactions on
         
        
        
        
        
            DOI : 
10.1109/TEMC.2010.2064319