• DocumentCode
    1369464
  • Title

    Capacitance switching with vacuum circuit breakers-a comparative evaluation

  • Author

    Glinkowski, Mietek ; Greenwood, Allan ; Hill, John ; Mauro, Ralph ; Varneckes, Vidmantas

  • Author_Institution
    Dept. of Electr. Power Eng., Rensselaer Polytech. Inst., Troy, NY, USA
  • Volume
    6
  • Issue
    3
  • fYear
    1991
  • fDate
    7/1/1991 12:00:00 AM
  • Firstpage
    1088
  • Lastpage
    1095
  • Abstract
    A statistical approach for determining the probability of reignition during capacitance switching by vacuum circuit breakers is described, wherein the dielectric recovery following current interruption is probed by overstressing the contact gap. It is found that the breakdown data can be quite well described by the Weibull distribution. The method is used to compare the capacitance switching performance of vacuum interrupters having copper/chromium and copper/bismuth contacts. Results imply a reignition rate for copper/bismuth almost two orders of magnitude higher than that for copper/chromium. Reignitions tend to occur when the arc angle (the period of arcing before current zero) is short, regardless of the contact material. The gap between CuCr contacts recovers more quickly than that between CuBi contacts. Very few reignitions after 2.5 ms were observed with CuCr contacts, whereas for CuBi reignitions persisted from 6 to 7 ms. This increases the likelihood of an overvoltage accompanying a reignition
  • Keywords
    circuit breakers; vacuum apparatus; CuBi contacts; CuCr contacts; Weibull distribution; breakdown data; capacitance switching; contact gap overstressing; current interruption; dielectric recovery; reignition probability; vacuum circuit breakers; Bismuth; Capacitance; Chromium; Circuit breakers; Copper; Dielectrics; Electric breakdown; Probability; Switching circuits; Weibull distribution;
  • fLanguage
    English
  • Journal_Title
    Power Delivery, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0885-8977
  • Type

    jour

  • DOI
    10.1109/61.85852
  • Filename
    85852