Title :
Thin-Wire Model Using Subcellular Extensions in the Finite-Difference Time-Domain Analysis of Thin and Lossy Insulated Cylindrical Structures in Lossy Media
Author :
Hyun, Seung-Yeup ; Kim, Se-Yun
Author_Institution :
Korea Inst. of Sci. & Technol., Seoul, South Korea
Abstract :
Recently, a subcellular thin-wire model for the finite-difference time-domain (FDTD) simulation of resistively coated cylinders with lossless insulating and surrounding media was presented. In this paper, it is shown that this model can be extended to lossy cases. The material discontinuity between lossy insulating and surrounding media is corrected as the time-domain boundary condition. The convolution term of the boundary condition is solved by employing a recursive technique. Applying the contour-path integration to the FDTD unit cells around the wire, one may find the coarse-grid-based equation with the correction term and factors for the material discontinuity and the quasi-static field behavior around the wire. In the 2-D cylindrical coordinates with rotational symmetry, the validity of the proposed model is confirmed by an impedance analysis of insulated and resistive antennas according to the electrical properties of insulating and surrounding media, as well as the choice of cell size.
Keywords :
absorbing media; finite difference time-domain analysis; insulated wires; 2D cylindrical coordinates; coarse-grid-based equation; contour-path integration; electrical properties; finite-difference time-domain analysis; impedance analysis; lossy insulated cylindrical structures; lossy media; material discontinuity; quasi-static field behavior; recursive technique; resistive antennas; resistive coated cylinders; rotational symmetry; subcellular thin-wire model; time-domain boundary condition; Boundary conditions; Cable insulation; Convolution; Dielectrics and electrical insulation; Equations; Finite difference methods; Humans; Impedance; Time domain analysis; Wires; Finite-difference time-domain (FDTD) methods; insulated cylinders; thin wires;
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
DOI :
10.1109/TEMC.2009.2028612