• DocumentCode
    1370029
  • Title

    Investigation of Denaturation of Hydrophobic Perfluoropolymer Surfaces and Their Applications for Micropatterns on Biochip

  • Author

    Kobayashi, Taizo ; Shimizu, Kazunori ; Konishi, Satoshi

  • Author_Institution
    Ritsumeikan Global Innovation Res. Organ., Ritsumeikan Univ., Kusatsu, Japan
  • Volume
    21
  • Issue
    1
  • fYear
    2012
  • Firstpage
    62
  • Lastpage
    67
  • Abstract
    The mechanism causing the denaturation of hydrophobicity of a micropatterned perfluoropolymer surface through the damage that occurs during the fabrication process is investigated. Using the results of the investigation, we successfully formed highly hydrophobic patterns without any loss of hydrophobicity even on low-thermal-tolerance substrates such as polycarbonates. We previously reported that the loss of hydrophobicity could be reduced by employing Cu as a dry etching mask and that hydrophobicity could be restored by postannealing the surface at 230°C. In this study, we investigate the detailed influence of process parameters on the binding condition and hydrophobicity of the perfluoropolymer surface. Even when the postannealing temperature was reduced to 145°C , by employing 50-nm-thick Cu as an etching mask, it was possible to form highly hydrophobic perfluoropolymer patterns having a contact angle of 110.3°. The hydrophobicity of the formed surface could be restored to its original value by postannealing at 145°C. This was possible because the depth of the damaged perfluoropolymer surface that contained unsaturated bonds was shallower when a Cu mask was used than when an Al mask was used. The developed technology can be employed in biochip applications such as cell patterning and droplet generation.
  • Keywords
    annealing; contact angle; etching; hydrophobicity; lab-on-a-chip; biochip; cell patterning; contact angle; denaturation; droplet generation; dry etching; etching mask; hydrophobicity; micropatterns; perfluoropolymer surfaces; polycarbonates; postannealing; size 50 nm; temperature 145 degC; temperature 230 degC; thermal-tolerance substrates; Copper; Etching; Silicon; Substrates; Biological cells; fabrication; microfluidics; surface engineering;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2011.2170818
  • Filename
    6070941