• DocumentCode
    1370370
  • Title

    Structure and Performance of {\\hbox {Nb}}_{3}{{\\hbox {Sn}}} Superconducting Wires Prepared From Sn-Based Alloy Sheets

  • Author

    Tachikawa, K. ; Ando, T. ; Sasaki, H. ; Yamaguchi, M. ; Takeuchi, T.

  • Author_Institution
    Fac. of Eng., Tokai Univ., Hiratsuka, Japan
  • Volume
    21
  • Issue
    3
  • fYear
    2011
  • fDate
    6/1/2011 12:00:00 AM
  • Firstpage
    2533
  • Lastpage
    2536
  • Abstract
    Sn-based sheets with Ta, B or Nb particle dispersion have been prepared from consolidated alloys. A small amount of Ti addition strengthened the bonding between dispersed particles and the Sn matrix, which improved the workability of the sheet. The sheet was laminated with a Nb sheet, and wound into a Jelly Roll (JR) composite. The composite was easily fabricated to a wire without intermediate annealing. Thick and uniform Nb3Sn layers with nearly stoichiometric Sn concentration were synthesized by the mutual diffusion between Nb and Sn-based alloy layers. An offset Tc of ~18.1 K and an offset Bc2 (4.2 K) of ~26.5 T have been obtained after the heat treatment. The non-Cu Jc of the wires increased with decreasing the wire diameter. A non-Cu Jc of ~150 A/mm2 has been obtained at 4.2 K and 22 T. The Sn-Ta, Sn-B and Sn-Nb based sheet JR wires exhibited similar microstructures and superconducting performances.
  • Keywords
    critical current density (superconductivity); crystal microstructure; diffusion; heat treatment; niobium alloys; sheet materials; stoichiometry; tin alloys; type II superconductors; workability; Nb3Sn; Sn-based alloy sheets; critical current density; diffusion; dispersed particles; heat treatment; jelly roll composite; microstructure; stoichiometric concentration; superconducting wires; workability; Copper; Microstructure; Niobium; Superconducting filaments and wires; Tin; Wire; Microstructure; Sn–B alloy; Sn–Nb alloy; Sn–Ta alloy; superconducting performance;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/TASC.2010.2083624
  • Filename
    5621869