Title : 
Structure and Performance of 
 
  Superconducting Wires Prepared From Sn-Based Alloy Sheets
 
         
        
            Author : 
Tachikawa, K. ; Ando, T. ; Sasaki, H. ; Yamaguchi, M. ; Takeuchi, T.
         
        
            Author_Institution : 
Fac. of Eng., Tokai Univ., Hiratsuka, Japan
         
        
        
        
        
            fDate : 
6/1/2011 12:00:00 AM
         
        
        
        
            Abstract : 
Sn-based sheets with Ta, B or Nb particle dispersion have been prepared from consolidated alloys. A small amount of Ti addition strengthened the bonding between dispersed particles and the Sn matrix, which improved the workability of the sheet. The sheet was laminated with a Nb sheet, and wound into a Jelly Roll (JR) composite. The composite was easily fabricated to a wire without intermediate annealing. Thick and uniform Nb3Sn layers with nearly stoichiometric Sn concentration were synthesized by the mutual diffusion between Nb and Sn-based alloy layers. An offset Tc of ~18.1 K and an offset Bc2 (4.2 K) of ~26.5 T have been obtained after the heat treatment. The non-Cu Jc of the wires increased with decreasing the wire diameter. A non-Cu Jc of ~150 A/mm2 has been obtained at 4.2 K and 22 T. The Sn-Ta, Sn-B and Sn-Nb based sheet JR wires exhibited similar microstructures and superconducting performances.
         
        
            Keywords : 
critical current density (superconductivity); crystal microstructure; diffusion; heat treatment; niobium alloys; sheet materials; stoichiometry; tin alloys; type II superconductors; workability; Nb3Sn; Sn-based alloy sheets; critical current density; diffusion; dispersed particles; heat treatment; jelly roll composite; microstructure; stoichiometric concentration; superconducting wires; workability; Copper; Microstructure; Niobium; Superconducting filaments and wires; Tin; Wire; Microstructure; Sn–B alloy; Sn–Nb alloy; Sn–Ta alloy; superconducting performance;
         
        
        
            Journal_Title : 
Applied Superconductivity, IEEE Transactions on
         
        
        
        
        
            DOI : 
10.1109/TASC.2010.2083624