Title :
An Ultra Compact Integrated Front End for Wireless Neural Recording Microsystems
Author :
Perlin, Gayatri E. ; Wise, Kensall D.
Author_Institution :
Adv. Imaging Technol. Group, Massachusetts Inst. of Technol. Lincoln Lab., Lexington, MA, USA
Abstract :
Abstract-The design and performance of an integrated front end for high-channel-count neural recording microsystems is presented. This front end consists of a 3-D micromachined microelectrode array, realized using a new architecture that allows simple and rapid microassembly. A 64-site 3-D multiprobe, realized using the new architecture, interfaces with tissue volumes of less than 0.01 mm3 and has a footprint of 1 mm2. For amplification, filtering, and buffering of the recorded neural signals, a custom signal-conditioning circuit provides high gain (60 dB), low noise (4.8 μVrms), and low power (50 μW) in an area of 0.098 mm2. In addition, this circuitry implements bandwidth tuning, offset compensation, and wireless gain programmability. This new approach to system integration uses a microfabricated parylene overlay cable to electrically interconnect the 3-D array and signal-conditioning circuitry. In vivo results obtained using this integrated microsystem front end in its most compact form are presented.
Keywords :
amplification; analogue-digital conversion; bioMEMS; biomedical electrodes; medical computing; microassembling; microfabrication; neurophysiology; noise; prosthetics; signal processing equipment; wireless channels; 3D micromachined microelectrode array; 3D multiprobe; amplification; bandwidth tuning; buffering; custom signal-conditioning circuit; filtering; high-channel-count neural recording microsystem; integrated microsystem front end; microassembly; microfabricated parylene overlay cable; noise; offset compensation; power; recorded neural signals; tissue volume; ultracompact integrated front end; wireless gain programmability; wireless neural recording microsystem; Implantable biomedical devices; Microassembly; Neural prosthesis; Wireless communication; Implantable microsystems; microassembly; microsystem integration; neural prostheses;
Journal_Title :
Microelectromechanical Systems, Journal of
DOI :
10.1109/JMEMS.2010.2082496