DocumentCode :
1372126
Title :
Modeling the effects of nonlinear materials in ceramic chip capacitors for use in digital and analog applications
Author :
Cokkinides, George J. ; Becker, Benjamin
Author_Institution :
Dept. of Electr. & Comput. Eng., South Carolina Univ., Columbia, SC, USA
Volume :
23
Issue :
3
fYear :
2000
fDate :
8/1/2000 12:00:00 AM
Firstpage :
368
Lastpage :
374
Abstract :
This paper describes a physics-based numerical approach to building circuit models for electronic components that are made of nonlinear dielectrics. The resulting models are intended for use in time-domain circuit simulators to assess the effects of material nonlinearity on the electrical performance of such components as discrete de-coupling and filter capacitors that are used in digital and analog circuits. A 3-D electrostatic field solver is modified to take into account the nonlinear field dependence of the dielectric material and is employed to calculate the Q-V curve for any capacitive structure. Subsequently, a time integration method (similar to that used in SPICE) is utilized to devise an appropriate time-stepping algorithm for the current-charge relationship of a nonlinear capacitor that can be used to simulate its time-domain electrical characteristics. Sample results are provided to illustrate the methodology and the effects of the material nonlinearity on the performance of the capacitor
Keywords :
ceramic capacitors; circuit simulation; dielectric materials; time-domain analysis; 3D electrostatic field; analog circuit; ceramic chip capacitor; decoupling capacitor; digital circuit; electrical characteristics; filter capacitor; nonlinear dielectric material; numerical model; passive electronic component; time domain circuit simulation; time integration; time stepping algorithm; Analog circuits; Capacitors; Ceramics; Circuit simulation; Dielectric materials; Digital filters; Electronic components; Electrostatics; SPICE; Time domain analysis;
fLanguage :
English
Journal_Title :
Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3323
Type :
jour
DOI :
10.1109/6040.861549
Filename :
861549
Link To Document :
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