• DocumentCode
    1372126
  • Title

    Modeling the effects of nonlinear materials in ceramic chip capacitors for use in digital and analog applications

  • Author

    Cokkinides, George J. ; Becker, Benjamin

  • Author_Institution
    Dept. of Electr. & Comput. Eng., South Carolina Univ., Columbia, SC, USA
  • Volume
    23
  • Issue
    3
  • fYear
    2000
  • fDate
    8/1/2000 12:00:00 AM
  • Firstpage
    368
  • Lastpage
    374
  • Abstract
    This paper describes a physics-based numerical approach to building circuit models for electronic components that are made of nonlinear dielectrics. The resulting models are intended for use in time-domain circuit simulators to assess the effects of material nonlinearity on the electrical performance of such components as discrete de-coupling and filter capacitors that are used in digital and analog circuits. A 3-D electrostatic field solver is modified to take into account the nonlinear field dependence of the dielectric material and is employed to calculate the Q-V curve for any capacitive structure. Subsequently, a time integration method (similar to that used in SPICE) is utilized to devise an appropriate time-stepping algorithm for the current-charge relationship of a nonlinear capacitor that can be used to simulate its time-domain electrical characteristics. Sample results are provided to illustrate the methodology and the effects of the material nonlinearity on the performance of the capacitor
  • Keywords
    ceramic capacitors; circuit simulation; dielectric materials; time-domain analysis; 3D electrostatic field; analog circuit; ceramic chip capacitor; decoupling capacitor; digital circuit; electrical characteristics; filter capacitor; nonlinear dielectric material; numerical model; passive electronic component; time domain circuit simulation; time integration; time stepping algorithm; Analog circuits; Capacitors; Ceramics; Circuit simulation; Dielectric materials; Digital filters; Electronic components; Electrostatics; SPICE; Time domain analysis;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/6040.861549
  • Filename
    861549