A fast 3D modeling approach to electrical parameters extraction of bonding wires for RF circuits

Author

Qi, Xiaoning ; Yue, C. Patrick ; Arnborg, Torkel ; Soh, Hyongsok T. ; Sakai, Hiroyuki ; Yu, Zhiping ; Dutton, Robert W.

Author_Institution

Center for Integrated Syst., Stanford Univ., CA, USA

Volume

23

Issue

3

fYear

2000

fDate

8/1/2000 12:00:00 AM

Firstpage

480

Lastpage

488

Abstract

Bonding wires are extensively used in integrated circuit (IC) packaging and circuit design in RF applications. An approach to fast three-dimensional (3D) modeling of the geometry for bonding wires in RF circuits and packages is demonstrated. The geometry can readily be used to extract electrical parameters such as inductance and capacitance. An equivalent circuit is presented to model the frequency response of bonding wires. To verify simulation accuracy, test structures have been made and measured. Excellent agreement between simulated and measured data is achieved for frequencies up to 10 GHz. The model is well suited for the design and analysis of circuits for cellular phone communication (i.e., order 2 GHz) and future wireless communication (i.e., order 5 GHz)

Keywords

MMIC; UHF integrated circuits; cellular radio; equivalent circuits; frequency response; integrated circuit modelling; integrated circuit packaging; lead bonding; parameter estimation; 2 to 10 GHz; 3D modeling; 3D modeling approach; IC packaging; bonding wires; cellular phone communication; circuit design; electrical parameters; electrical parameters extraction; equivalent circuit; frequency response; simulation accuracy; test structures; wireless communication; Application specific integrated circuits; Bonding; Circuit simulation; Circuit synthesis; Computational geometry; Integrated circuit packaging; Parameter extraction; Radio frequency; Radiofrequency integrated circuits; Wires;

fLanguage

English

Journal_Title

Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1521-3323

Type

jour

DOI

10.1109/6040.861564

Filename

861564