MCM-D/C packaging solution for IBM latest S/390 servers

Author

Perfecto, Eric D. ; Shields, Ronald R. ; Malhotra, Ashwani K. ; Jeanneret, Mathias P. ; McHerron, Dale C. ; Katopis, George A.

Author_Institution

IBM Microelectron., Hopewell Junction, NY, USA

Volume

23

Issue

3

fYear

2000

fDate

8/1/2000 12:00:00 AM

Firstpage

515

Lastpage

520

Abstract

The G5, the most recent member of the S390 server family, was announced in May 1998. The multichip module (MCM) at the heart of the G5 system consists of 29 CMOS chips on a 127.5 mm glass ceramic substrate with 6 levels of thin films (TF) including 1 signal plane pair. System performance of the G5 exceeds 1000 MIPS. This breakthrough performance resulted from the synergy created by combining IBM´s leadership technologies in CMOS high frequency microprocessor design with advanced packaging and flip chip interconnections. From a substrate perspective. IBM moved from alumina ceramic with molybdenum (Mo) conductor to cordurite/glass ceramic, and copper (Cu) conductor, and from TF redistribution (4 levels) to TF wiring (6 levels). This paper discusses the TF implications from a change of substrate material and increased wiring density, as well as the need to implement a polyimide cushion layer as part of a pin grid array (PGA) fabrication process that supports 4224 I/O´s

Keywords

IBM computers; file servers; flip-chip devices; integrated circuit interconnections; multichip modules; polymer films; wiring; CMOS high frequency microprocessor design; G5 system; MCM-D/C packaging; S390 server family; flip chip interconnections; glass ceramic substrate; packaging; pin grid array; polyimide cushion layer; signal plane pair; wiring density; CMOS technology; Ceramics; Conducting materials; Copper; Electronics packaging; Glass; Heart; Multichip modules; Transistors; Wiring;

fLanguage

English

Journal_Title

Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1521-3323

Type

jour

DOI

10.1109/6040.861568

Filename

861568