DocumentCode
1373640
Title
Impact of temperature on substrate coupling in low-doped substrate
Author
Quaresma, H.J. ; dos Santos, P.M. ; Serra, A.C.
Author_Institution
Inst. de Telecomun., Inst. Super. Tecnico, Lisbon, Portugal
Volume
47
Issue
23
fYear
2011
Firstpage
1273
Lastpage
1275
Abstract
The effect of temperature on substrate coupling is reported for the first time. Modelling and experimental results are presented, showing a significant linear dependence of the substrate resistance with temperature in the range between 257 and 418 K. The observed decrease in substrate resistance at lower temperatures implies that the substrate noise coupling could be seriously underestimated if the temperature effect is not taken into account. These results reveal the importance of including the effects of temperature on the substrate resistance models for the correct modelling of the substrate noise coupling.
Keywords
monolithic integrated circuits; substrates; integrated circuits; low-doped substrate; monolithic integration; substrate noise coupling; substrate resistance models; temperature effect;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el.2011.2402
Filename
6077097
Link To Document