• DocumentCode
    1375272
  • Title

    HBT IC process with copper substrate

  • Author

    Guthrie, J. ; Mensa, D. ; Agarwal, B. ; Lee, Q. ; Pullela, R. ; Rodwell, M.J.W.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
  • Volume
    34
  • Issue
    5
  • fYear
    1998
  • fDate
    3/5/1998 12:00:00 AM
  • Firstpage
    467
  • Lastpage
    468
  • Abstract
    The authors have demonstrated a copper/polymer substrate HBT integrated circuit technology which offers a low loss microstrip transmission line environment, continuous back-side ground planes, and enhanced thermal performance
  • Keywords
    bipolar integrated circuits; copper; heterojunction bipolar transistors; integrated circuit technology; microstrip circuits; microwave integrated circuits; substrates; Cu; HBT integrated circuit technology; back-side ground plane; copper/polymer substrate; microstrip transmission line; thermal performance;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el:19980372
  • Filename
    674222
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1375272