Title :
40 Gbit/s optical receiver module using a flip-chip bonding technique for device interconnection
Author :
Miyamoto, Y. ; Yoneyama, M. ; Imai, Y. ; Kato, K. ; Tsunetsugu, H.
Author_Institution :
NTT Opt. Network Syst. Labs., Kanagawa, Japan
fDate :
3/5/1998 12:00:00 AM
Abstract :
A 10 Gbit/s optical receiver module has been designed with special regard to interconnection between a baseband distributed-amplifier IC and a waveguide PIN photodiode (WGPD) using a flip-chip bonding technique. A 40 Gbit/s receiver sensitivity of -23.5 dBm was experimentally obtained
Keywords :
flip-chip devices; optical receivers; 40 Gbit/s; baseband distributed-amplifier IC; device interconnection; flip-chip bonding; optical receiver module; waveguide PIN photodiode;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:19980337
