Title :
Enhancing the Fracture Resistance of Medium/Small-Sized TFT-LCDs Using the Six Sigma Methodology
Author :
Su, Chao-Ton ; Hsiao, Yu-Hsiang ; Liu, Yen-Lin
Author_Institution :
Dept. of Ind. Eng. & Eng. Manage., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Abstract :
Maintaining satisfactory fracture resistance of medium/small-sized thin-film transistor liquid crystal displays (TFT-LCDs) imposes additional challenges with the demand for thinner and larger display screens from customers. This paper presents a case study on the application of DMAIC-based Six Sigma methodology for improving the fracture resistance of medium/small-sized TFT-LCDs of display panels manufactured by a company. Analyses show that, in this case, the unsatisfactory fracture resistance reflected by bending strength was related to the defective TFT-LCD cutting plane. Therefore, the objective of the improvements was to reduce variations in the cutting process and to find solutions to control the process factors that influence the same, such as operators, scribing parameters, and scribing wheels. We obtained significant bending strength increases of 35% in the x-axis and 16% in the y -axis of medium/small-sized TFT-LCDs with the application of DMAIC. The quality performance was enhanced from lower than 1-sigma level to higher than 4-sigma level, in addition to a financial impact that translated into extra business revenue of at least 15.4%.
Keywords :
bending strength; flat panel displays; fracture toughness; liquid crystal displays; process control; quality control; six sigma (quality); thin film transistors; bending strength; cutting process; display panels manufacture; fracture resistance; medium-small-sized TFT-LCD; process control; quality control; six sigma methodology; thin film transistor liquid crystal displays; Companies; Glass; Loading; Resistance; Six sigma; Thin film transistors; Bending strength; DMAIC; Six Sigma; cutting process; fracture resistance; thin-film transistor liquid crystal display;
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCPMT.2011.2171492