DocumentCode :
1377788
Title :
Loop Heat Pipes for Cooling Systems of Servers
Author :
Maydanik, Yury F. ; Vershinin, Sergey V. ; Pastukhov, Vladimir G. ; Fried, Stephen
Author_Institution :
Inst. of Thermal Phys., Russian Acad. of Sci., Ekaterinburg, Russia
Volume :
33
Issue :
2
fYear :
2010
fDate :
6/1/2010 12:00:00 AM
Firstpage :
416
Lastpage :
423
Abstract :
Loop heat pipes (LHPs) are exceptionally efficient heat-transfer devices that employ a closed loop evaporation-condensation cycle that can be used to cool densely packed electronic systems that reject large quantities of heat, including computers and their central processing units (CPUs). Tests were carried out on miniature ammonia LHPs with a CPU thermal simulator using different ways of condenser cooling. The possibility of maintaining the cooled object temperatures between 40°C and 70°C with heat load changing from 100 to 320 W was demonstrated. Subsequent tests of these devices in a 1U computer with dual core advanced micro devices Opteron CPUs, dissipating between 95 and 120 W, have confirmed the advantages and heat transfer efficiency of LHP-based cooling systems used to cool CPU in 1U chassis.
Keywords :
ammonia; condensation; cooling; heat pipes; thermal management (packaging); CPU; CPU thermal simulator; LHP-based cooling systems; central processing units; closed loop evaporation-condensation cycle; condenser cooling; cool densely packed electronic systems; cooled object temperatures; heat transfer devices; loop heat pipes; microdevices; miniature ammonia LHP; power 95 W to 320 W; servers; temperature 40 degC to 70 degC; Cooling system; loop heat pipe; server; thermal resistance;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2009.2035514
Filename :
5373917
Link To Document :
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