Title : 
Development of Optical Subassembly for Plastic Optical Fiber Transceiver in High-Speed Applications
         
        
            Author : 
Zhang, Jing ; Ramana, Pamidighantam V. ; Chandrappan, Jayakrishnan ; Tan, CheeWei ; Chai, Yi Yoon ; Khoo, Yee Mong ; Teo, Wei Liang ; Shing, John Lau Hon ; Gomex, Philbert Oliver ; Wang, Ting ; Ramkumar, V.M.
         
        
            Author_Institution : 
Inst. of Microelectron., A*STAR (Agency for Sci., Technol. & Res.), Singapore, Singapore
         
        
        
        
        
            fDate : 
5/1/2010 12:00:00 AM
         
        
        
        
            Abstract : 
A low-cost optical subassembly design for large core fiber transceiver is presented. The complete transceiver module is realized by assembling the low-cost optical subassembly directly on the transceiver functional printed circuit board. -7 dBm optical power output and 6 dB extinction ratio are achieved on transmitter by the vertical self-alignment and horizontal passive alignment at the transmitter. 190 m link distance is achieved at 2.5 Gb/s and 340 m link distance is achieved at 1.25 Gb/s for the plastic optic fiber (POF) transmitter with grade index plastic optical fiber. 145 m link distance is achieved at 2.5 Gb/s for the POF receiver.
         
        
            Keywords : 
optical fibre networks; optical transmitters; transceivers; bit rate 1.25 Gbit/s; bit rate 2.5 Gbit/s; high-speed applications; large core fiber transceiver; optical subassembly; plastic optical fiber transceiver; transceiver functional printed circuit board; transceiver module; transmitter; Optical subassembly; high speed; low-cost package; plastic optical fiber;
         
        
        
            Journal_Title : 
Advanced Packaging, IEEE Transactions on
         
        
        
        
        
            DOI : 
10.1109/TADVP.2009.2033810