• DocumentCode
    1378027
  • Title

    Parallelism, Performance, and Energy-Efficiency Tradeoffs for In Situ Sensor Data Processing

  • Author

    Stanley-Marbell, Phillip

  • Author_Institution
    IBM Res. - Zurich, Rüschlikon, Switzerland
  • Volume
    3
  • Issue
    1
  • fYear
    2011
  • fDate
    3/1/2011 12:00:00 AM
  • Firstpage
    16
  • Lastpage
    19
  • Abstract
    The in situ processing of vast amounts of data, available intermittently in networks of sensors, motivates investigation of means for achieving high performance when required, but ultralow-power dissipation when idle. One approach is the use of embedded multiprocessor systems, leading to tradeoffs between parallelism, performance, energy-efficiency, and cost. To evaluate these tradeoffs, and to gain insight for future system designs, this letter presents the design, implementation, and evaluation of a miniature, energy-scalable, 24-processor module, L24, for compute-intensive in situ sensor data processing tasks. The platform provides idle power dissipation over an order of magnitude lower than systems employing a monolithic processor of equivalent performance, while dynamic power dissipation remains competitive. Taking into account both application computation and interprocessor communication demands, it is shown that there may exist an optimum operating voltage that minimizes either time-to-solution, energy usage, or the energy-delay product. This optimum operating point is formulated analytically, calibrated with system measurements and instruction-level microarchitectural simulation, and evaluated for the hardware platform and application presented.
  • Keywords
    embedded systems; microprocessor chips; multiprocessing systems; parallel architectures; power aware computing; sensor fusion; 24-processor module L24; application computation; compute intensive in situ sensor data processing; embedded multiprocessor system; energy delay product; energy efficiency tradeoffs; idle power dissipation; instruction level microarchitectural simulation; interprocessor communication; optimum operating voltage; Analytic modeling; energy-efficiency; hardware measurement; networked sensors; parallelism;
  • fLanguage
    English
  • Journal_Title
    Embedded Systems Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1943-0663
  • Type

    jour

  • DOI
    10.1109/LES.2010.2092412
  • Filename
    5635315