DocumentCode :
1378734
Title :
The Heat Is On: Graphene Applications
Author :
Balandin, Alexander A.
Author_Institution :
He is a professor of electrical engineering and founding chair of the Materials Science and Engineering Program at the University of California, Riverside.
Volume :
5
Issue :
4
fYear :
2011
Firstpage :
15
Lastpage :
19
Abstract :
It is well recognized that power consumption and heat removal in state-of-the-art integrated circuits (ICs) with the nanometer size of transistors is an urgent challenge. The electronic industry´s transition to multicore designs, where the performance increase is achieved not via the increase in the clock frequency but rather through the increase in the number of processors, helped to alleviate some of the thermal issues but has not solved the problem of the nonuniformity of heat distribution inside a computer chip.
Keywords :
graphene; nanoelectronics; thermal management (packaging); computer chip; electronic industry; graphene applications; heat distribution; heat removal; power consumption; state of the art integrated circuits; Graphene; Heating; Multicore processing; Power consumption; Power distribution;
fLanguage :
English
Journal_Title :
Nanotechnology Magazine, IEEE
Publisher :
ieee
ISSN :
1932-4510
Type :
jour
DOI :
10.1109/MNANO.2011.943327
Filename :
6083576
Link To Document :
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