Smart-pixel array technology for free-space optical interconnects

Author

Liu, Yue ; Strzelecka, E.M. ; Nohava, J. ; Hibb-Brenner, M.K. ; Towe, Elias

Author_Institution

Honeywell Technol. Center, Minneapolis, MN, USA

Volume

88

Issue

6

fYear

2000

fDate

6/1/2000 12:00:00 AM

Firstpage

764

Lastpage

768

Abstract

This paper describes a smart-pixel array technology that is being developed at Honeywell for use in chip-to-chip optical interconnections based on free-space optics. The technology combines large-scale, two-dimensional arrays of optoelectronic and microoptical elements with VLSI electronics to enable high-density, high-speed interchip input/output capability in the optical domain. We have demonstrated prototype modules with 16/spl times/16 and 32/spl times/32 emitter and interleaved detector arrays.

Keywords

VLSI; micro-optics; optical arrays; optical interconnections; smart pixels; transceivers; Honeywell; VLSI; chip-to-chip optical interconnections; free-space optical interconnects; high-speed interchip input/output capability; interleaved detector arrays; microoptical elements; smart-pixel array technology; two-dimensional arrays; High speed optical techniques; Integrated circuit interconnections; Optical arrays; Optical fiber communication; Optical interconnections; Optical receivers; Optical transmitters; Sensor arrays; Smart pixels; Stimulated emission;

fLanguage

English

Journal_Title

Proceedings of the IEEE

Publisher

ieee

ISSN

0018-9219

Type

jour

DOI

10.1109/5.867690

Filename

867690