Title :
Cryogenic Test-Bed Applied to 9 K NbN RSFQ Devices Operation
Author :
Aurino, M. ; Baggetta, E. ; Bouat, S. ; Michal, V. ; Renaud, D. ; Bornier, C. ; Laine, M. ; Villégier, J.C.
Author_Institution :
INAC, CEA-Grenoble, Grenoble, France
fDate :
6/1/2011 12:00:00 AM
Abstract :
NbN RSFQ circuits operating at 9 K reduce the cooling constraints especially for portable, remote, telecoms or medical imaging applications. We have developed a test-bed to study the operating temperature of the various mixed RF and digital circuit blocks of NbN `HyperSCAN´ project test vehicle 1 cm2 chips. The use of a widespread helium cryostat (`Orange-ILL´) allows us to stabilize the chip temperature in the range 2.9 K-20 K with thermal oscillations lower than 0.1 K. The chip is mounted on a PCB and shielded from the external field: the PCB provides a multi-connection packaging used in order to study temperature and frequency operation of 30 GHz NbTiN CPW filters, RSFQ gates, analog SQUID and NbN/TaN/NbN SNS junctions arrays. The comparison between electrical simulations and tests is made on flexible, ~ 56 cm long, micro-strip line ribbon cable carrying 32 signals each including bias lines, in the range of DC-3 GHz, combined with 4 semi-rigid ~ 40 GHz coaxial cables. By removing spurious resonances, it is expected to take full benefit of the large bandwidth, low insertion loss and low thermal conductivity of the set-up. We emphasis on the flexibility, large yield, reliability and reduced cost of such packaging coupled to He cooling exchanger for applying to testers and to future 9 K NbN multi-ADC green and remote systems when only low electrical power sources are available.
Keywords :
cryogenics; superconducting devices; HyperSCAN project test vehicle; RSFQ circuit; RSFQ device operation; RSFQ gate; SNS junction array; chip temperature; coaxial cable; cooling exchanger; cryogenic testbed; digital circuit block; electrical power source; electrical simulation; frequency 30 GHz; helium cryostat; insertion loss; medical imaging application; multiconnection packaging; rapid single flux quantum circuit; reliability; remote system; temperature 2.9 K to 20 K; thermal conductivity; thermal oscillation; Helium; Junctions; Niobium; Power cables; Superconducting cables; Temperature distribution; Temperature measurement; Cryogenic packaging; Josephson circuits; RSFQ; superconducting devices;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
DOI :
10.1109/TASC.2010.2086417