Title :
Variable stiffness fabrics with embedded shape memory materials for wearable applications
Author :
Chenal, Thomas P. ; Case, Jennifer C. ; Paik, Jamie ; Kramer, Rebecca K.
Author_Institution :
Sch. of Mech. Eng., Purdue Univ., West Lafayette, IN, USA
Abstract :
Materials with variable stiffness have the potential to provide a range of new functionalities, including system reconfiguration by tuning the location of rigid links and joints. In particular, wearable applications would benefit from variable stiffness materials in the context of active braces that may stiffen when necessary and soften when mobility is required. In this work, we present fibers capable of adjusting to provide variable stiffness in wearable fabrics. The variable stiffness fibers are made from shape memory materials, where shape memory alloy (SMA) is coated with a thin film of shape memory polymer (SMP). The fibers, which are fabricated via a continuous feed-through process, reduce in bending stiffness by an order of magnitude when the SMP goes through the glass transition. The transition between rubbery and glassy state is accomplished by direct joule heating of the embedded SMA wire. We employ a COMSOL model to relate the current input to the time required for the fibers to transition between stiffness states. Finally, we demonstrate how this device can be worn and act as a joint stability brace on human fingers.
Keywords :
bending; fabrics; mechanical stability; shape memory effects; COMSOL model; SMA; SMP; active braces context; bending stiffness reduction; continuous feed-through process; direct joule heating; embedded shape memory materials; glass transition; human fingers; joint stability brace; rigid joints; rigid links; shape memory alloy; shape memory polymer; system reconfiguration; variable stiffness fabrics; variable stiffness materials; wearable applications; Fabrics; Heating; Polymers; Programmable logic arrays; Shape; Wires;
Conference_Titel :
Intelligent Robots and Systems (IROS 2014), 2014 IEEE/RSJ International Conference on
Conference_Location :
Chicago, IL
DOI :
10.1109/IROS.2014.6942950