• DocumentCode
    138026
  • Title

    Strengthening of 3D printed robotic parts via fill compositing

  • Author

    Belter, Joseph T. ; Dollar, Aaron M.

  • Author_Institution
    Dept. of Mech. Eng. & Mater. Sci., Yale Univ., New Haven, CT, USA
  • fYear
    2014
  • fDate
    14-18 Sept. 2014
  • Firstpage
    2886
  • Lastpage
    2891
  • Abstract
    Three-dimensional printing technology, also known as additive manufacturing, has shown a significant increase in popularity as the cost of printers comes down and part accuracy and build quality continually improves. To date, the major limitation of the various additive manufacturing techniques is the limited range of print materials and properties, with 3d printed parts unable to be used in most load-bearing applications in robotics and other domains. In this paper, we present a technique for increasing the strength of 3d printed parts while retaining the benefits of the process such as ease and speed of implementation and complex part geometries. By carefully placing voids in the printed parts, which are later filled with higher-strength resins, we can improve the overall part strength and stiffness by up to 45% and 25%, respectively. We show three-point bend testing data comparing solid printed ABS samples with those strengthened through the fill compositing process, as well as examples of 3D printed parts used in robotic applications.
  • Keywords
    bending strength; elasticity; filling; industrial robots; rapid prototyping (industrial); three-dimensional printing; 3D printed robotic parts; additive manufacturing techniques; complex part geometries; fill compositing process; higher-strength resins; load-bearing applications; print materials; solid printed ABS samples; three-dimensional printing technology; three-point bend testing data; Fingers; Frequency division multiplexing; Materials; Mobile robots; Testing; Three-dimensional displays;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Intelligent Robots and Systems (IROS 2014), 2014 IEEE/RSJ International Conference on
  • Conference_Location
    Chicago, IL
  • Type

    conf

  • DOI
    10.1109/IROS.2014.6942959
  • Filename
    6942959