Title :
Evaluation of solderless wrapped connections for central office use
Author_Institution :
Bell Telephone Laboratories, Inc., New York, N. Y.
fDate :
5/1/1959 12:00:00 AM
Abstract :
Since 1952, when the solderless wrapped connection first was described publicly,1 its use in telephone central offices has grown steadily. Several hundred million solderless connections are being wrapped annually in the Bell System today, and the growth is continuing.
Keywords :
Accelerated aging; Copper; Silver; Stress; Temperature measurement; Wires;
Journal_Title :
American Institute of Electrical Engineers, Part I: Communication and Electronics, Transactions of the
DOI :
10.1109/TCE.1959.6372979
