Title :
Comparation of thermal and hygro effects on the degradation of LED package
Author :
Xiaosong Ma ; Zhang, G.Q.
Author_Institution :
Guilin Univ. of Electron. Technol.Guilin, Guilin, China
Abstract :
Humidity test is common to all the packaged integrated circuits, few works have been reported on the study of the humidity effects combined with high temperature on packaged LEDs. Moreover, the packaged LEDs are also subjected to moisture environment in many of their applications. In this work, the high temperature-humidity (95°C-85% RH) aging test is used to evaluate the reliability of the packaged LEDs with respect to their optical output properties. The degradation of two kinds of commercial packaged light-emitting diodes (LEDs) are investigated using high temperature aging combined with fast moisture diffusion method, which is quatitively calculated by simulation. First, the tested LED devises is put in the chamber for 84 hours at 95°C/85%RH, then the temperature is set to 85°C in order to know the effects of moistute loss, and then the LED devises are under stress conditions 65°C/85%RH for 50 hours. At last sample are put in the oven for 25 hours at 105 °C. An optical measurement system consisting of a one-meter diameter integrating sphere and a spectroradiometer is set up to measure the luminous flux of the LEDs. The spectral flux responsivity of the measurement system is calibrated at the start and the end of the measurement of LEDs to achieve high measurement accuracy. During the optical measurement, the LED under test is powered up with a nominal constant current as recommended by the manufacturers of the packaged LEDs. Temperature and moisture has effects on both type of epoxy packaged LED the luminous flux, temperature color but almost no effectsof the color purity, peak wave length and half wave width. Further study are still onging to investigated the relation between aging time and optical degradation and also relation between moisture content and optical degradation.
Keywords :
ageing; electronics packaging; light emitting diodes; photometry; reliability; thermal engineering; LED package degradation; commercial packaged light-emitting diodes; epoxy packaged LED; fast moisture diffusion method; high temperature aging; high temperature-humidity; humidity effects; humidity test; hygro effects; luminous flux measurement; moisture environment; moisture loss; nominal constant current; optical degradation; optical measurement system; packaged integrated circuits; reliability; spectral flux responsivity; spectroradiometer; temperature 105 degC; temperature 65 degC; temperature 85 degC; temperature 95 degC; temperature color; thermal effects; time 25 hour; time 50 hour; time 84 hour; Degradation; Humidity; Integrated circuit reliability; Light emitting diodes; Moisture; Temperature measurement; Expoxy Packaging Material; LED Package; Thermal and Hygro; degradation;
Conference_Titel :
Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2014 15th international conference on
Conference_Location :
Ghent
Print_ISBN :
978-1-4799-4791-1
DOI :
10.1109/EuroSimE.2014.6813782