Title :
Packaging technique for gain enhancement of electrically small antenna designed on gallium arsenide
Author :
Song, C.T.P. ; Hall, P.S. ; Ghafouri-Shiraz, H. ; Wake, D.
Author_Institution :
Dept. of Electron. & Electr. Eng., Birmingham Univ., UK
fDate :
8/31/2000 12:00:00 AM
Abstract :
A novel method is presented for achieving a complete RF front end product equipped with its radiator within a single chip package. This packaging technique provides an alternative solution to problems associated with reduced size antennas implemented on gallium arsenide (GaAs) substrates, such as restoration of the antenna gain by 15 dB. This configuration will help to reduce manufacturing costs associated with connecting the antenna to the RF front-end chip
Keywords :
MMIC; antenna radiation patterns; gallium arsenide; integrated circuit packaging; microstrip antennas; transceivers; GaAs; GaAs substrates; RF front end chip; SHF; electrically small antenna; gain enhancement; integrated radiator; manufacturing costs reduction; packaging technique; single chip package; single chip transceiver;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:20000996
