Multiphysics modeling for current carrying capability of a power package

In this paper, the impact of the lead frame design on the current carrying capability of the a power package is investigated. The coupled electrical-thermal and mechanical stress simulations are conducted, with the transient characteristics captured. The DoE simulations with regard to different lead frame design, different currents, and micro crack impact are studied to find the impact on current carrying capability. The simulation results show that the twisted Z shape lead design induces the highest stress level when the initial crack was induced by the assembly process, which could speed up the failure and reduce the current carrying capability.