Silicon-germanium base heterojunction bipolar transistors by molecular beam epitaxy

The devices were fabricated using molecular-beam epitaxy (MBE), low-temperature processing, and germanium concentrations of 0, 6%, and 12%. The transistors demonstrate current gain, and show the expected increase in collector current as a result of reduced bandgap due to Ge incorporation in the base. For a 1000-AA base device containing 12% Ge, a six-times increase in collector current was measured at room temperature, while a 1000-times increase was observed to 90 K. The temperature dependence of the collector current of the Si/sub 0.88/Ge/sub 0.12/ base transistor is consistent with a bandgap shrinkage in the base of 50 meV. For the homojunction transistors, base widths as thin as 800 AA were grown, corresponding to a neutral base width of no more than 400 AA.<>