• DocumentCode
    138111
  • Title

    2D micro-chamber for DC plasma working at low power

  • Author

    Rochus, Veronique ; Samara, Vladimir ; Vereecke, Bart ; Soussan, P. ; Onsia, Bart ; Rottenberg, Xavier

  • Author_Institution
    IMEC, Leuven, Belgium
  • fYear
    2014
  • fDate
    7-9 April 2014
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    The plasma micro-chambers proposed in the literature make typically usage of relatively high RF power applied to cavities characterized by their 3D geometry, difficult to integrate on wafer. This work reports on the design, wafer-level fabrication and characterization of 2D DC plasma micro-chambers working at atmospheric pressure with noble and inert gases like helium and argon. The MEMS technology developed for this purpose allows the definition of small gaps in order to reduce the power consumption. The strike and sustain electrodes are made of Titanium Nitrite, material of choice for its hardness, and thus resistance to the ion bombardment, as well as his high melting point temperature, that allows the proximity and contact with high temperature plasmas. Measurements were performed, applying a high voltage to these electrodes, and measuring the relation between the voltage and the current when the plasma is ignited. Considering different gaps between the electrodes we can extract then the power consumed in the plasma and optimize the 2D micro-chamber.
  • Keywords
    Townsend discharge; argon; helium; microfabrication; micromechanical devices; plasma devices; plasma diagnostics; plasma temperature; titanium compounds; 2D DC plasma microchamber; 3D geometry; MEMS technology; Townsend avalanche mechanism; argon; atmospheric pressure; design; electrodes; hardness; helium; high melting point temperature; high voltage; high-temperature plasmas; ignition; inert gases; ion bombardment resistance; noble gases; plasma measurement; power consumption; pressure 1 atm; relatively high RF power; titanium nitrite; wafer-level fabrication; Abstracts; Area measurement; Electrodes; Micromechanical devices; Microorganisms; Photonics; Plasma measurements;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2014 15th international conference on
  • Conference_Location
    Ghent
  • Print_ISBN
    978-1-4799-4791-1
  • Type

    conf

  • DOI
    10.1109/EuroSimE.2014.6813810
  • Filename
    6813810