DocumentCode
138111
Title
2D micro-chamber for DC plasma working at low power
Author
Rochus, Veronique ; Samara, Vladimir ; Vereecke, Bart ; Soussan, P. ; Onsia, Bart ; Rottenberg, Xavier
Author_Institution
IMEC, Leuven, Belgium
fYear
2014
fDate
7-9 April 2014
Firstpage
1
Lastpage
6
Abstract
The plasma micro-chambers proposed in the literature make typically usage of relatively high RF power applied to cavities characterized by their 3D geometry, difficult to integrate on wafer. This work reports on the design, wafer-level fabrication and characterization of 2D DC plasma micro-chambers working at atmospheric pressure with noble and inert gases like helium and argon. The MEMS technology developed for this purpose allows the definition of small gaps in order to reduce the power consumption. The strike and sustain electrodes are made of Titanium Nitrite, material of choice for its hardness, and thus resistance to the ion bombardment, as well as his high melting point temperature, that allows the proximity and contact with high temperature plasmas. Measurements were performed, applying a high voltage to these electrodes, and measuring the relation between the voltage and the current when the plasma is ignited. Considering different gaps between the electrodes we can extract then the power consumed in the plasma and optimize the 2D micro-chamber.
Keywords
Townsend discharge; argon; helium; microfabrication; micromechanical devices; plasma devices; plasma diagnostics; plasma temperature; titanium compounds; 2D DC plasma microchamber; 3D geometry; MEMS technology; Townsend avalanche mechanism; argon; atmospheric pressure; design; electrodes; hardness; helium; high melting point temperature; high voltage; high-temperature plasmas; ignition; inert gases; ion bombardment resistance; noble gases; plasma measurement; power consumption; pressure 1 atm; relatively high RF power; titanium nitrite; wafer-level fabrication; Abstracts; Area measurement; Electrodes; Micromechanical devices; Microorganisms; Photonics; Plasma measurements;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2014 15th international conference on
Conference_Location
Ghent
Print_ISBN
978-1-4799-4791-1
Type
conf
DOI
10.1109/EuroSimE.2014.6813810
Filename
6813810
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