Title :
Very compact thin power amplifier module for gigahertz-band cellular systems
Author :
Kagaya, O. ; Sekine, K. ; Yamashita, K.
Author_Institution :
Central Res. Lab., Hitachi Ltd., Tokyo, Japan
fDate :
2/5/1998 12:00:00 AM
Abstract :
A power amplifier module for gigahertz-band cellular phone systems. Developed using a build-up structure based on MCM-D technology and all planar passive circuit components, is investigated. It is shown that the very compact thin module can be incorporated with a thickness of <1 mm and a volume of <0.1 cc
Keywords :
UHF power amplifiers; cellular radio; multichip modules; 1 mm; 1.75 GHz; MCM-D technology; compact thin module; gigahertz-band cellular systems; planar passive circuit components; power amplifier module;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:19980184
