DocumentCode :
1381385
Title :
Lifetime Estimation of an ACF in Navigation (March 2010)
Author :
Cho, Youngjin ; Kim, Jaejung
Author_Institution :
Reliability Anal. Res. Center, Hanyang Univ., Seoul, South Korea
Volume :
11
Issue :
1
fYear :
2011
fDate :
3/1/2011 12:00:00 AM
Firstpage :
106
Lastpage :
111
Abstract :
Recently, liquid crystal display (LCD) panels have become very important components for portable electronics. In the high-density interconnection material, anisotropic conductive films (ACFs) are used to connect the outer lead of the tape-automated bonding to the transparent indium tin oxide electrodes of the LCD panel. The ACF consists of an adhesive polymer matrix and randomly dispersed conductive balls. In this paper, we analyzed the failure mode/mechanism of ACF which were identified as conductive ball corrosion, delamination, cracking, and polymer expansion/swelling. In the accelerated life test, we selected primary stress factors, such as temperature and humidity. As time passed, an increase in connection resistance was observed. Low [50% relative humidity (RH)] and high (95% RH) conditions of average humidity show about 3-4 times difference in lifetime at the same average temperature of 30 °C. Hence, the humidity was shown to be more highly influential on the lifetime of the ACF, considering the driving patterns of regular consumers.
Keywords :
circuit reliability; conducting polymers; conductive adhesives; corrosion; interconnections; life testing; liquid crystal displays; LCD panels; anisotropic conductive films; conductive ball corrosion; lifetime estimation; liquid crystal display panels; navigation; portable electronics; tape-automated bonding; Accelerated life test (ALT); adhesion; anisotropic conductive film (ACF); conductive ball; delamination; lifetime; swelling;
fLanguage :
English
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
Publisher :
ieee
ISSN :
1530-4388
Type :
jour
DOI :
10.1109/TDMR.2010.2093137
Filename :
5638618
Link To Document :
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