Characterization and modeling of the AuCuSn thin solder joint under thermal cycling

Author

Pelisset, Tiphaine ; Karunamurthy, B. ; Otremba, Ralf ; Antretter, Thomas

Author_Institution

KAI-Kompetenzzentrum Automobil- und Industrieelektron. GmbH, Villach, Austria

fYear

2014

fDate

7-9 April 2014

Firstpage

1

Lastpage

6

Abstract

Thin Au₂Cu₆Sn₂ solder joints have been identified to provide improved electrical and thermal device performance compared to thicker solder joints [1]. Both the material high thermal conductivity and the reduced joint thickness improve the thermal dissipation through the solder joint, making the thin Au₂Cu₆Sn₂ solder layer very attractive for high power devices. In this paper, we establish a material model for the Au₂Cu₆Sn₂ material in order to study solder thermal fatigue using finite element analysis.

Keywords

copper alloys; finite element analysis; gold alloys; solders; thermal conductivity; thermal stress cracking; tin alloys; Au₂Cu₆Sn₂; finite element analysis; high power devices; material high thermal conductivity; material model; reduced joint thickness; solder thermal fatigue; thermal cycling; thermal dissipation; thin solder joint; Abstracts; Gold; Heating; Materials; Performance evaluation; Temperature measurement; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2014 15th international conference on

Conference_Location

Ghent

Print_ISBN

978-1-4799-4791-1

Type

conf

DOI

10.1109/EuroSimE.2014.6813832

Filename

6813832