Title :
Experimental investigation of the visco-plastic mechanical properties of a Sn-based solder alloy for material modelling in Finite Element calculations of automotive electronics
Author :
Metasch, R. ; Roellig, M. ; Kabakchiev, A. ; Metais, B. ; Ratchev, R. ; Meier, Konrad ; Wolter, Klaus-Jurgen
Author_Institution :
Mater. Diagnostics, Fraunhofer Inst. for Ceramic Technol. & Syst., Dresden, Germany
Abstract :
Here, we present an advanced experimental procedure for determining the properties of a SnAg3.5 solder alloy in the strain range of primary creep under cyclic load and isothermal conditions. The challenge in this experiment is the accurate high-resolution measurement of sample elongation used for a closed-loop control, as well as avoiding the influence of sensor and specimen clamping. We realized reproducible strain rate control within a total specimen elongation of 60 μm. The tensile-compression experiment comprises strain rate variation for three strain amplitudes with integrated relaxation stages followed by a measurement of cyclic fatigue. The strain rate at every strain stage was varied in the range of 1E-3 to 1E-6 per second. At the end of every strain stage a time-limited relaxation experiment is performed, where the specimen´s length is kept constant, while the stress evolution is recorded. Finally, the specimen is subjected to cyclic fatigue until a drop of 50 % of the initial materials strength is reached. The total procedure is performed in a temperature range from -40 to 150 °C. We prove the capability of common creep models to map the observed cyclic stress-strain hysteresis as well as stress dependency on strain rate. The results reveal substantial limitations of common stationary creep models and strongly suggest the application of advanced visco-plastic material models for an accurate description of the solder alloy properties. The experimental data presented can be used for the calibration of unified visco-plastic constitutive models initially proposed by Chaboché et al. and further extended during the past two decades.
Keywords :
automotive electronics; creep; elongation; fatigue; finite element analysis; silver alloys; solders; stress-strain relations; tin alloys; viscoplasticity; SnAg; advanced visco-plastic material models; automotive electronics; closed-loop control; cyclic fatigue measurement; cyclic load; cyclic stress-strain hysteresis; finite element calculations; high-resolution measurement; isothermal conditions; material modelling; materials strength; primary creep; sample elongation; sensor; solder alloy; specimen clamping; stationary creep models; strain amplitudes; strain rate control; strain rate variation; stress dependency; stress evolution; temperature -40 degC to 150 degC; tensile-compression experiment; time-limited relaxation experiment; unified visco-plastic constitutive models; visco-plastic mechanical property; Abstracts; Degradation; Strain; Temperature sensors;
Conference_Titel :
Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2014 15th international conference on
Conference_Location :
Ghent
Print_ISBN :
978-1-4799-4791-1
DOI :
10.1109/EuroSimE.2014.6813860