Title :
High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm
Author :
Ryu, Woonghwan ; Yim, Myung-Jin ; Ahn, Seungyoung ; Lee, Junho ; Kim, Woopoung ; Paik, Kyung-Wook ; Kim, Joungho
Author_Institution :
Korea Adv. Inst. of Sci. & Technol., Taejon, South Korea
fDate :
9/1/2000 12:00:00 AM
Abstract :
This paper firstly reports on the high-frequency SPICE model of the ACF flip-chip interconnections up to 13 GHz. The extraction process is based on an optimization procedure, called a genetic algorithm, which is known as a robust optimization tool. The proposed equivalent circuit model of the ACF interconnection can readily be used in SPICE circuit simulations for signal integrity analysis of high-frequency packages. Two different ACF interconnections were studied using the Au-coated polymer ball and Ni-filled ball. The extracted models of the two ACFs were found strongly dependent on not only size and rigidity of the conducting balls, but also on their magnetic permeability
Keywords :
SPICE; digital integrated circuits; equivalent circuits; flip-chip devices; genetic algorithms; high-speed integrated circuits; integrated circuit interconnections; microstrip lines; microwave integrated circuits; 13 GHz; Au; Au-coated polymer ball; HF SPICE model; Ni; Ni-filled ball; SPICE circuit simulations; anisotropic conductive film; ball magnetic permeability; conducting ball rigidity; conducting ball size; equivalent circuit model; extraction process; flip-chip interconnections; genetic algorithm; high-frequency SPICE model; high-frequency packages; optimization procedure; signal integrity analysis; Anisotropic conductive films; Circuit simulation; Equivalent circuits; Genetic algorithms; Integrated circuit interconnections; Magnetic analysis; Packaging; Robustness; SPICE; Signal analysis;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/6144.868855
