• DocumentCode
    1382225
  • Title

    Scale effects on fluid flow and heat transfer in microchannels

  • Author

    Sabry, Mohamad-Nabil

  • Author_Institution
    Mansoura Univ., Egypt
  • Volume
    23
  • Issue
    3
  • fYear
    2000
  • fDate
    9/1/2000 12:00:00 AM
  • Firstpage
    562
  • Lastpage
    567
  • Abstract
    Many investigators have recently experimentally established that fluid flow and heat transfer characteristics in microchannels, used to cool electronic chips, deviate from those of normally sized channels. Deviations increase as the channel size decreases. Many hypotheses were advanced to explain some of the observed deviations. However, they were usually in contradiction with other observed deviations. Hence, no conclusive explanation has been given so far for these phenomena. In this work, observed deviations will be listed, different hypotheses advanced to interpret these deviations will he critically revised. Finally, a new hypothesis will be advanced based on the increased role of surface roughness on flow and heat transfer in microchannels. Simple models will be built capable of reproducing observed trends for both friction and heat transfer coefficient in the laminar region, as well as giving an improved prediction for the laminar turbulent transition
  • Keywords
    channel flow; cooling; forced convection; integrated circuit packaging; laminar flow; surface topography; turbulence; channel size; electronic chips; fluid flow; heat transfer; heat transfer coefficient; laminar region; microchannels; surface roughness; turbulent transition; Electronics cooling; Fluid flow; Friction; Heat transfer; Microchannel; Rough surfaces; Surface roughness; Thermal conductivity; Thermal management; Viscosity;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/6144.868859
  • Filename
    868859