Title :
Thermal dynamics and the time constant domain
Author :
Székely, Vladimir ; Rencz, Márta
Author_Institution :
Dept. of Electron Devices, Tech. Univ. Budapest, Hungary
fDate :
9/1/2000 12:00:00 AM
Abstract :
The time-constant spectrum representation is a useful description of the dynamic thermal behavior of packages, assemblies and microsystems. After presenting the idea of the time constant spectrum representation of microelectronic structures, the paper provides an algorithm that can be used for time constant spectrum calculation in thermal simulator programs. The obtained time-constant spectrum can be the basis of calculating the transient behavior pulse thermal resistance diagrams, and structure reconstruction. All these applications are presented in the paper with examples
Keywords :
digital simulation; packaging; reduced order systems; thermal resistance; transient analysis; dynamic thermal behavior; microelectronic structures; pulse thermal resistance diagrams; spectrum calculation; spectrum representation; structure reconstruction; thermal dynamics; thermal simulator programs; time constant domain; transient behavior; Assembly; Capacitance; Circuits; Frequency domain analysis; Impedance; Microelectronics; Packaging; Reduced order systems; Thermal engineering; Thermal resistance;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/6144.868862
