DocumentCode :
138277
Title :
Wide frequency band assessment of 28 nm FDSOI technology platform for analogue and RF applications
Author :
Makovejev, S. ; Esfeh, B. Kazemi ; Barral, V. ; Planes, N. ; Haond, M. ; Flandre, Denis ; Raskin, Jean-Pierre ; Kilchytska, V.
Author_Institution :
ICTEAM Inst., Univ. catholique de Louvain, Louvain-la-Neuve, Belgium
fYear :
2014
fDate :
7-9 April 2014
Firstpage :
53
Lastpage :
56
Abstract :
This work presents an in-depth wide-frequency band assessment of 28 nm FDSOI MOSFETs for analogue and RF applications. The focus is mainly on such figures of merit (FoM) as the transconductance gm, the output conductance gd, the intrinsic gain Av and the cut-off frequencies ft and fmax. Firstly, 28 nm FDSOI MOSFETs are compared with other advanced devices and are shown to outperform them. Secondly, gm-Av analogue metrics is demonstrated to be affected by operation frequency. Small-signal parameters variation is limited and dominated by self-heating effect. This is in contrast to the first generation of ultra-thin body and BOX devices without a ground plane where coupling through the substrate has a considerable effect. Thirdly, the self-heating effect is analysed and shown to be smaller than previously predicted by simulations for such devices. Fourthly, it is shown that ft reaches ~270 GHz in the shortest devices.
Keywords :
MOSFET; silicon-on-insulator; BOX devices; FDSOI MOSFETs; FDSOI technology platform; FoM; RF applications; analogue applications; cut-off frequency; figures of merit; fully-depleted silicon-on-insulator; ground plane; intrinsic gain; output conductance; self-heating effect; size 28 nm; small-signal parameter variation; transconductance; ultra-thin body generation; wide frequency band assessment; Frequency dependence; Immune system; Logic gates; MOSFET; Radio frequency; Substrates; Thermal resistance; RF; SOI; UTBB; analogue FoM; self-heating;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultimate Integration on Silicon (ULIS), 2014 15th International Conference on
Conference_Location :
Stockholm
Type :
conf
DOI :
10.1109/ULIS.2014.6813904
Filename :
6813904
Link To Document :
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