DocumentCode :
138294
Title :
Fabrication and thermoelectric characterization of GeSn nanowires
Author :
Noroozi, M. ; Hamawandi, B. ; Toprak, M.S. ; Radamson, H.H.
Author_Institution :
Dept. of Mater. & Nano Phys., KTH R. Inst. of Technol., Kista, Sweden
fYear :
2014
fDate :
7-9 April 2014
Firstpage :
125
Lastpage :
128
Abstract :
In this study, GeSn nanowires (NWs) were fabricated and the thermoelectric performance in terms of power factor and contact resistance have been investigated and compared to Ge and Si. The ohmic contact to the NWs was made by Pt/Ti whereas low contact resistance was obtained by Ni-GeSn (or Ni-Ge) layers. A detailed investigation was performed to process towards low resistance Ni-GeSn phase for GeSn NWs. The phase formation of Ni-GeSn layers was examined by x-ray diffraction (XRD) and the residual strain in GeSn beneath the Ni-GeSn was also measured by high resolution reciprocal lattice mapping (HRRLM). It was demonstrated that Ni reaction with GeSn layer resulted in strain reduction in the remained GeSn material due to Ni outdiffusion to the GeSn NWs demonstrated higher Seebeck coefficient compared to Ge and Si NWs, which suggest promising thermoelectric properties in GeSn.
Keywords :
Seebeck effect; X-ray diffraction; chemical interdiffusion; contact resistance; germanium compounds; interface structure; internal stresses; nanofabrication; nanowires; nickel; ohmic contacts; platinum; semiconductor growth; semiconductor materials; semiconductor-metal boundaries; thermoelectric power; titanium; Ni-GeSn; Pt-Ti-GeSn; Seebeck coefficient; X-ray diffraction; XRD; contact resistance; high resolution reciprocal lattice mapping; nanowires; ohmic contact; out-diffusion; phase formation; power factor; residual strain; strain reduction; thermoelectricity; Conductivity; Nanowires; Silicon; Temperature measurement; Tin; GeSn nanowires; Ni-GeSn; contact resistance; themoelectric;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultimate Integration on Silicon (ULIS), 2014 15th International Conference on
Conference_Location :
Stockholm
Type :
conf
DOI :
10.1109/ULIS.2014.6813914
Filename :
6813914
Link To Document :
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