CAD-oriented equivalent-circuit modeling of on-chip interconnects on lossy silicon substrate

Author

Zheng, Ji ; Hahm, Yeon-Chang ; Tripathi, Vijai K. ; Weisshaar, Andreas

Author_Institution

Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA

Volume

48

Issue

9

fYear

2000

fDate

9/1/2000 12:00:00 AM

Firstpage

1443

Lastpage

1451

Abstract

A new, comprehensive CAD-oriented modeling methodology for single and coupled interconnects on an Si-SiO₂ substrate is presented. The modeling technique uses a modified quasi-static spectral domain electromagnetic analysis which takes into account the skin effect in the semiconducting substrate. Equivalent-circuit models with only ideal lumped elements, representing the broadband characteristics of the interconnects, are extracted. The response of the proposed SPICE compatible equivalent-circuit models is shown to be in good agreement with the frequency-dependent transmission line characteristics of single and general coupled on-chip interconnects

Keywords

CMOS integrated circuits; SPICE; circuit CAD; elemental semiconductors; equivalent circuits; field effect MMIC; integrated circuit interconnections; microstrip lines; silicon; silicon compounds; skin effect; spectral-domain analysis; CAD-oriented equivalent-circuit modeling; SPICE compatible models; Si-SiO₂; broadband characteristics; coupled interconnects; frequency-dependent transmission line characteristics; on-chip interconnects; quasi-static spectral domain electromagnetic analysis; skin effect; CMOS integrated circuits; CMOS technology; Distributed parameter circuits; Integrated circuit interconnections; Radio frequency; SPICE; Semiconductor device modeling; Silicon; Skin effect; Substrates;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/22.868993

Filename

868993