Title :
CAD-oriented equivalent-circuit modeling of on-chip interconnects on lossy silicon substrate
Author :
Zheng, Ji ; Hahm, Yeon-Chang ; Tripathi, Vijai K. ; Weisshaar, Andreas
Author_Institution :
Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA
fDate :
9/1/2000 12:00:00 AM
Abstract :
A new, comprehensive CAD-oriented modeling methodology for single and coupled interconnects on an Si-SiO2 substrate is presented. The modeling technique uses a modified quasi-static spectral domain electromagnetic analysis which takes into account the skin effect in the semiconducting substrate. Equivalent-circuit models with only ideal lumped elements, representing the broadband characteristics of the interconnects, are extracted. The response of the proposed SPICE compatible equivalent-circuit models is shown to be in good agreement with the frequency-dependent transmission line characteristics of single and general coupled on-chip interconnects
Keywords :
CMOS integrated circuits; SPICE; circuit CAD; elemental semiconductors; equivalent circuits; field effect MMIC; integrated circuit interconnections; microstrip lines; silicon; silicon compounds; skin effect; spectral-domain analysis; CAD-oriented equivalent-circuit modeling; SPICE compatible models; Si-SiO2; broadband characteristics; coupled interconnects; frequency-dependent transmission line characteristics; on-chip interconnects; quasi-static spectral domain electromagnetic analysis; skin effect; CMOS integrated circuits; CMOS technology; Distributed parameter circuits; Integrated circuit interconnections; Radio frequency; SPICE; Semiconductor device modeling; Silicon; Skin effect; Substrates;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
