DocumentCode
138299
Title
Tensile strained Ge membranes
Author
Shah, V.A. ; Trushkevych, O. ; Myronov, M. ; Rhead, S. ; Halpin, John ; Edwards, R. ; Leadley, D.R.
Author_Institution
Dept. of Phys., Univ. of Warwick, Coventry, UK
fYear
2014
fDate
7-9 April 2014
Firstpage
137
Lastpage
140
Abstract
Germanium membranes of 50-1000 nm thickness have been fabricated by a combination of epitaxial growth on a Si substrate and simple etching processes. The biaxial tensile strain in these membranes has been measured by high-resolution X-ray diffraction and by ultrasonic vibrational spectroscopy. The later technique also shows that membranes have a Q-factor of ~3000 at low temperature. The stain in these membranes is extremely isotropic and the surface is observed to be very smooth, with an rms roughness of below 2 nm. The process of membrane fabrication also serves to remove the misfit dislocation network that originally forms at the Si/Ge interface, with benefits for the mechanical, optical and electrical properties of the crystalline membranes.
Keywords
X-ray diffraction; dislocations; elemental semiconductors; epitaxial growth; etching; germanium; membranes; semiconductor epitaxial layers; semiconductor growth; surface roughness; tensile strength; Ge-Si; Q-factor; Si; Si substrate; Si-Ge interface; biaxial tensile strain; crystalline membranes; electrical properties; epitaxial growth; etching process; germanium membrane thickness; high-resolution X-ray diffraction; mechanical properties; misfit dislocation network; optical properties; rms roughness; tensile strained Ge membrane fabrication; ultrasonic vibrational spectroscopy; Conductivity; Epitaxial growth; Germanium; Q-factor; Resonant frequency; Silicon; Substrates; Q-factor; epitaxy; germanium; membrane;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultimate Integration on Silicon (ULIS), 2014 15th International Conference on
Conference_Location
Stockholm
Type
conf
DOI
10.1109/ULIS.2014.6813917
Filename
6813917
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