Embedded transmission line MMIC 1-W flip chip assembly using a Z-axis interconnect

Author

Budka, Thomas ; Ketterson, Andrew ; Tserng, Hua-Quen ; Stiborek, Leon ; Heinrich, Lonny ; Smith, Robert ; Ables, Bill ; Kyhl, Cary ; Worthen, Karl ; Brehm, Gailon ; Reddick, John

Author_Institution

Raytheon TI Syst., Dallas, TX, USA

Volume

8

Issue

6

fYear

1998

fDate

6/1/1998 12:00:00 AM

Firstpage

238

Lastpage

240

Abstract

The authors describe a new type of electronic packaging topology using embedded transmission-line (ETL) monolithic microwave integrated circuits (MMIC´s) along with a new state-of-the-art Z-axis material that acts as a chip adhesive as well as an electrical connection with a carrier substrate. The results from the first two flip chip assemblies that were produced under the Microwave Analog Front End Technology (MAFET) Thrust 2 Program are presented. The flip chip packages provided greater than 1-W package output power on a Kovar housing floor with greater than 8-dB package large signal gain at 11.5 GHz

Keywords

MMIC; flip-chip devices; integrated circuit interconnections; integrated circuit packaging; microassembling; 1 W; 11.5 GHz; 8 dB; Kovar housing floor; MAFET Thrust 2 Program; MMIC flip chip assembly; Z-axis interconnect; Z-axis material; carrier substrate; chip adhesive; electronic packaging topology; embedded transmission line MMIC; flip chip packages; monolithic microwave integrated circuits; Assembly; Circuit topology; Distributed parameter circuits; Electronics packaging; Flip chip; MMICs; Microwave integrated circuits; Monolithic integrated circuits; Power transmission lines; Transmission lines;

fLanguage

English

Journal_Title

Microwave and Guided Wave Letters, IEEE

Publisher

ieee

ISSN

1051-8207

Type

jour

DOI

10.1109/75.678578

Filename

678578