مرکز منطقه ای اطلاع رساني علوم و فناوري - Special issue on materials, processing and reliability of 3D interconnects

DocumentCode :

1383532

Title :

Special issue on materials, processing and reliability of 3D interconnects

Volume :

Issue :

fYear :

2010

Firstpage :

3548

Lastpage :

3548

Abstract :

Provides notice of upcoming special issue(s) of interest to practitioners and researchers.

fLanguage :

English

Journal_Title :

Electron Devices, IEEE Transactions on

Publisher :

ieee

ISSN :

0018-9383

Type :

jour

DOI :

10.1109/TED.2010.2090593

Filename :

5640537

Link To Document :