• DocumentCode
    1384227
  • Title

    Field sensitivity in spin-valve sandwiches with antiferromagnetic NiO films

  • Author

    Lee, S.S. ; Hwang, D.G. ; Park, C.M. ; Lee, K.A. ; Kim, M.Y. ; Rhee, J.R.

  • Author_Institution
    Dept. of Phys., Sangji Univ., Wonju, South Korea
  • Volume
    32
  • Issue
    5
  • fYear
    1996
  • fDate
    9/1/1996 12:00:00 AM
  • Firstpage
    3416
  • Lastpage
    3418
  • Abstract
    We have investigated the MR ratios and the field sensitivities in Ni81Fe15/Cu/Ni81Fe19 spin-valve sandwiches grown on antiferromagnetic NiO films as a function of the NiO thickness and the uniaxial deposition field. The MR ratio has a maximum value of 4.5% at 420 Å of NiO and 180 Oe of uniaxial deposition field, and a field sensitivity of 0.6%/Oe. In order to obtain a higher MR ratio and field sensitivity, we have studied the effects of adding a Co layer between the interfaces of NiFe and Cu and also the effects of a NiO film on top or at bottom on the spin-valve sandwiches. The MR sandwiches with the Co layer increases to 8.2%, however, the sensitivity decreases to 0.37%/Oe due to the high coercivity of Co. The Co inserted structure with the NiO film on top has a low MR ratio of 5.7% and a high sensitivity of 5.8%/Oe. The thermal stability of the sandwiches with the NiO film on top is superior to that of the NiO film at bottom
  • Keywords
    antiferromagnetic materials; copper; iron alloys; magnetic multilayers; magnetic thin films; magnetoresistance; nickel alloys; nickel compounds; Co layer; Ni81Fe15-Cu-Ni81Fe19; Ni81Fe15/Cu/Ni81Fe19 spin-valve sandwich; NiO; antiferromagnetic NiO film; coercivity; field sensitivity; magnetoresistance ratio; thermal stability; uniaxial deposition field; Antiferromagnetic materials; Coercive force; Glass; Magnetic field measurement; Magnetic films; Magnetoresistance; Physics; Sputtering; Thermal resistance; Thermal stability;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/20.538642
  • Filename
    538642