Title :
The evaluation of fast-flow, fast-cure underfills for flip chip on organic substrate
Author :
Wun, Kai-Lam Bill ; Margaritis, George
Author_Institution :
Electron. Assembly Dev. Center, Hewlett-Packard Co., Palo Alto, CA, USA
fDate :
3/1/1998 12:00:00 AM
Abstract :
Seven underfill formulations have been evaluated for fast-cure, fast-flow, and low-clearance flow applications in flip chip assemblies. The effect of different underfill ingredients on processing and reliability is discussed. It will be shown that at least one formulation has superior flow rate under a 30-μm die than any currently available commercial underfill
Keywords :
encapsulation; flip-chip devices; integrated circuit packaging; integrated circuit reliability; 30 micron; fast-cure underfills; flip chip; low-clearance flow applications; organic substrate; reliability; Additives; Assembly; Curing; Epoxy resins; Flip chip; Glass; Moisture; Packaging; Temperature; Thermal expansion;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
