DocumentCode :
1384821
Title :
On the positive temperature dependence of the thermal conductivity of a diamond-based heat sink paste
Author :
Hasselman, D.P.H. ; Donaldson, Kimberly Y.
Author_Institution :
Thermophys. Res. Lab., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
Volume :
21
Issue :
1
fYear :
1998
fDate :
3/1/1998 12:00:00 AM
Firstpage :
124
Lastpage :
126
Abstract :
The strongly positive temperature dependence of literature thermal conductivity data for n-decane/diamond pastes is suggested to be largely due to the corresponding strongly positive temperature dependence of the finite interfacial thermal conductance resulting from phonon scattering at the n-decane/diamond interface. It is suggested that increases in the diamond particle size will create corresponding increases in the thermal conductivity, coupled with a decrease in the positive temperature dependence
Keywords :
diamond; heat sinks; packaging; thermal conductivity; C; diamond-based heat sink paste; finite interfacial thermal conductance; packaging; phonon scattering; positive temperature dependence; thermal conductivity; Electronic packaging thermal management; Electronics packaging; Equations; Frequency; Heat sinks; Heat transfer; Materials science and technology; Temperature dependence; Temperature distribution; Thermal conductivity;
fLanguage :
English
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9886
Type :
jour
DOI :
10.1109/95.679041
Filename :
679041
Link To Document :
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