• DocumentCode
    1384850
  • Title

    Analytical modeling of spreading resistance in flux tubes, half spaces, and compound disks

  • Author

    Yovanovich, M.M. ; Culham, J.R. ; Teertstra, Pete

  • Author_Institution
    Waterloo Univ., Ont., Canada
  • Volume
    21
  • Issue
    1
  • fYear
    1998
  • fDate
    3/1/1998 12:00:00 AM
  • Firstpage
    168
  • Lastpage
    176
  • Abstract
    A review of previously published models and solutions pertinent to the issue of modeling thermal resistances of diamond on copper heat sink systems is presented. The many particular solutions are shown to be special cases of the comprehensive model developed for a circular heat source in perfect thermal contact with the top surface of a compound disk which consists of two isotropic layers in perfect thermal contact. The bottom surface of the compound disk is subjected to a convective or contact cooling condition. Whenever possible simple models and correlation equations are presented for ease of computation. Bounds are presented for estimating the overall thermal resistance of several important cases
  • Keywords
    cooling; electric resistance; heat sinks; modelling; packaging; reviews; temperature distribution; thermal resistance; analytical modeling; circular heat source; compound disks; contact cooling condition; convective cooling condition; correlation equations; diamond on Cu heat sink systems; flux tubes; half spaces; review; spreading resistance; thermal resistances; Analytical models; Copper; Equations; Heat sinks; Immune system; Resistance heating; Space heating; Temperature; Thermal conductivity; Thermal resistance;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9886
  • Type

    jour

  • DOI
    10.1109/95.679046
  • Filename
    679046