DocumentCode
1384850
Title
Analytical modeling of spreading resistance in flux tubes, half spaces, and compound disks
Author
Yovanovich, M.M. ; Culham, J.R. ; Teertstra, Pete
Author_Institution
Waterloo Univ., Ont., Canada
Volume
21
Issue
1
fYear
1998
fDate
3/1/1998 12:00:00 AM
Firstpage
168
Lastpage
176
Abstract
A review of previously published models and solutions pertinent to the issue of modeling thermal resistances of diamond on copper heat sink systems is presented. The many particular solutions are shown to be special cases of the comprehensive model developed for a circular heat source in perfect thermal contact with the top surface of a compound disk which consists of two isotropic layers in perfect thermal contact. The bottom surface of the compound disk is subjected to a convective or contact cooling condition. Whenever possible simple models and correlation equations are presented for ease of computation. Bounds are presented for estimating the overall thermal resistance of several important cases
Keywords
cooling; electric resistance; heat sinks; modelling; packaging; reviews; temperature distribution; thermal resistance; analytical modeling; circular heat source; compound disks; contact cooling condition; convective cooling condition; correlation equations; diamond on Cu heat sink systems; flux tubes; half spaces; review; spreading resistance; thermal resistances; Analytical models; Copper; Equations; Heat sinks; Immune system; Resistance heating; Space heating; Temperature; Thermal conductivity; Thermal resistance;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
Publisher
ieee
ISSN
1070-9886
Type
jour
DOI
10.1109/95.679046
Filename
679046
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