Title :
Tracing the thermal behavior of ICs
Author :
Székely, Vladimir ; Rencz, Márta ; Courtois, Bernard
Author_Institution :
Tech. Univ. Budapest, Hungary
Abstract :
Today´s increased power and packaging densities demand designers´ attention to the effects of heat on ICs. The authors review thermal and electrothermal simulation and measurement methods, thermal package characterization, and the concept and techniques of design for thermal testability
Keywords :
heat; integrated circuit design; integrated circuit packaging; ICs; electrothermal simulation; measurement methods; packaging; thermal behavior; thermal package characterization; thermal testability; Boundary conditions; Computational modeling; Differential equations; Electrothermal effects; Finite element methods; Heat transfer; Mesh generation; Packaging; Temperature; Testing;
Journal_Title :
Design & Test of Computers, IEEE
