• DocumentCode
    1385075
  • Title

    Fabrication of three-dimensional microstructures by electrochemically welding structures formed by microcontact printing on planar and curved substrates

  • Author

    Jackman, Rebecca J. ; Brittain, Scott T. ; Whitesides, George M.

  • Author_Institution
    Dept. of Chem. & Chem. Biol., Harvard Univ., Cambridge, MA, USA
  • Volume
    7
  • Issue
    2
  • fYear
    1998
  • fDate
    6/1/1998 12:00:00 AM
  • Firstpage
    261
  • Lastpage
    266
  • Abstract
    This paper describes two convenient techniques for the fabrication of three-dimensional (3-D) structures with micron-sized features. The methods use microcontact printing (μCP) to define patterns with feature sizes as small as 20 μm both on planar substrates and on cylinders (diameter ~2 mm). Electrodeposition serves as a micron-scale tool for metal deposition and welding that transforms these patterned surfaces and cylinders into metallic complex 3-D microstructures (e.g., tetrahedra). Final tetrahedra (~2-cm sides) have feature sizes as small as 50 μm
  • Keywords
    electric welding; electrodeposition; micromachining; printing; curved substrate; cylinder; electrochemical welding; electrodeposition; fabrication; metallic three-dimensional microstructure; microcontact printing; patterned surface; planar substrate; tetrahedra; Chemical lasers; Crystalline materials; Fabrication; Micromachining; Micromechanical devices; Microstructure; Resists; Silicon; Soft lithography; Welding;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/84.679396
  • Filename
    679396