DocumentCode
1385075
Title
Fabrication of three-dimensional microstructures by electrochemically welding structures formed by microcontact printing on planar and curved substrates
Author
Jackman, Rebecca J. ; Brittain, Scott T. ; Whitesides, George M.
Author_Institution
Dept. of Chem. & Chem. Biol., Harvard Univ., Cambridge, MA, USA
Volume
7
Issue
2
fYear
1998
fDate
6/1/1998 12:00:00 AM
Firstpage
261
Lastpage
266
Abstract
This paper describes two convenient techniques for the fabrication of three-dimensional (3-D) structures with micron-sized features. The methods use microcontact printing (μCP) to define patterns with feature sizes as small as 20 μm both on planar substrates and on cylinders (diameter ~2 mm). Electrodeposition serves as a micron-scale tool for metal deposition and welding that transforms these patterned surfaces and cylinders into metallic complex 3-D microstructures (e.g., tetrahedra). Final tetrahedra (~2-cm sides) have feature sizes as small as 50 μm
Keywords
electric welding; electrodeposition; micromachining; printing; curved substrate; cylinder; electrochemical welding; electrodeposition; fabrication; metallic three-dimensional microstructure; microcontact printing; patterned surface; planar substrate; tetrahedra; Chemical lasers; Crystalline materials; Fabrication; Micromachining; Micromechanical devices; Microstructure; Resists; Silicon; Soft lithography; Welding;
fLanguage
English
Journal_Title
Microelectromechanical Systems, Journal of
Publisher
ieee
ISSN
1057-7157
Type
jour
DOI
10.1109/84.679396
Filename
679396
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