Title :
Computer-controlled system for surface resistance measurements of HTc superconducting films
Author :
Kuhlemann, Thorsten ; Hinken, Johann Heyen
Author_Institution :
Inst. fur Hochfrequenztech., Tech. Univ., Braunschweig, Germany
fDate :
6/1/1991 12:00:00 AM
Abstract :
A measurement system capable of determining the microwave surface resistance of high-temperature superconducting films is described. The measurement is based on evaluating the resonant curve of a circular cylindrical waveguide transmission resonator. The cylindrical wall, and the top plane of the resonator are made of copper. The test sample is the ground plane of the resonator. The surface resistance of the test sample can be directly evaluated from the quality factor of the resonator when the surface resistance of copper is used as a reference. The computer-controlled measurement system consists of a backward-wave oscillator, the cylindrical resonator, a spectrum analyzer for the detection of power and frequency, and a refrigerator for cooling the resonator and the test sample. Several measurements have been made. Surface resistances of different thin-film samples have been determined. The lowest values measured so far approximate 25 mΩ at 66.8 GHz and 77 K
Keywords :
computerised instrumentation; electric resistance measurement; high-temperature superconductors; microwave measurement; spectral analysers; superconducting thin films; surface conductivity; 25 mohm; 66.8 GHz; 77 K; Cu; backward-wave oscillator; circular cylindrical waveguide transmission resonator; computer-controlled measurement system; cooling; cylindrical resonator; cylindrical wall; ground plane; high-temperature superconducting films; microwave surface resistance; quality factor; reference; refrigerator; resonant curve; spectrum analyzer; surface resistance measurements; Copper; Electrical resistance measurement; Frequency measurement; Microwave measurements; Power measurement; Q factor; Resonance; Superconducting films; Surface resistance; Testing;
Journal_Title :
Instrumentation and Measurement, IEEE Transactions on